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Whether your electronics application involves semiconductor devices, printed circuit boards, probe cards, microwave components, wafers or thermocouples microblasting has a solution for you. Processes include:
 Conformal Coating Removal – Micro-abrasive blasting is a fast, cost effective and environmentally friendly method for selectively removing conformal coatings from printed circuit boards. It simplifies selective coating removal and virtually eliminates damage to circuit boards or surrounding components. With no toxic by-products, the hassle of waste removal required for other coating removal processes, is eliminated.
Selective Removal Around Delicate Conductors – The precise control of a MicroBlaster allows magnesium oxide filler to be selectively removed without damaging the delicate wire conductors used in thermocouple manufacturing.
Microblasting can also remove the meniscus surrounding the glass/metal seal on other electronic packages.
 Deburring Microwave Components Without Dimensional Changes – Microblasting effectively removes fine burrs from edges and openings of complex waveguide components used in microwave communication products. More importantly, the pinpoint precision of the MicroBlaster® ensures burr removal doesn’t cause dimensional changes or radiuses.
“Shockless” Wafer Cutting – A MicroBlaster® can be used to cut slots, holes and apertures in thin, fragile substrates. It is also used for contouring or beveling edges of silicon power devices to expose a junction, or for removal of paper diffusion mask residue and metallization layers on wafers.
Adhesion Enhancement on Flex Circuitry – Comco’s MicroBlasters deliver exacting control for delicate texturing to the surface of rigid and flexible substrate materials. This surface preparation provides adhesion enhancement for bonded components and increases the peel strength of the material when it is attached to other substrates. This technique has also been successful for strain gauge applications.
Delicate Cleaning of Ceramic Devices – One of the chief benefits of micro-abrasive blasting is its ability to perform delicate cleaning without damaging the underlying surface. Remove oxidation, residue, discoloration and surface defects from alumina substrates, probe rings, electrodes, connectors and other electronic devices effectively with micro-abrasive blasting.
For more information, see the following articles:
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