The selective cleaning process uses the abrasive qualities of MicroBlasting to carefully erode layers of unwanted material from a base substrate. The process takes advantage of the different physical properties of the two layers. Brittle materials can be removed from soft ductile layers, or soft ductile layers can be removed from brittle layers.
Two blasting variables to consider before removing a soft ductile material from a brittle base substrate are abrasive selection and particle velocity.
Why the right abrasive matters.
Caution! The tendency is to use higher velocities because the process can go quicker that way. However, if not done carefully a higher velocity stream can damage the brittle substrate.